Part. No. CTEM6HG1256
Layers: 6Layer
Surface Finished: Lead Free HASL + Gold Finger
Material: FR4
Thickness: 1.6mm
PNL Size: 280.41*189.94
PCS/SPNL: 2up
Hole Quantity:
Minimum Wire Width: 3.5mils
Smallest finish hole size: 10mils
Finished copper: 1OZ
Solder Mask colour: Green
Silkscreen colour: White
CNC/V-CUT/bevel edge

Standard: IPC-A-600G Class III
Certificates: UL/94V-0/ISO

TECHNOLOGY:
. RoHS/ Lead Free
. HDI Microvias
. Blind Vias
. Buried Vias
. Selective Plating
. Impedance Control
Manufacturing Standard:
. IPC-A-600G Class II
. IPC-A-600G Class III
. PERFAG 2E for Double-Sided Board
. PERFAG 3C for Multilayer Board
Capability
Min. Finished Holes Size: 0.008" (0.20mm)
Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)
Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)
Maximum copper thickness: 5oz (140um)
Thin board thickness:
. DS - 0.008 inches (0.20mm)
. 4/L - 0.016 (0.40mm)
. 6/L - 0.020 inches (0.60mm)
Maximum board thickness:
. 275.8mil (7.0mm)
Surface treatment:
. HASL/lead free HAL/gold plating
. Immersion gold
. Immersion tin
. Immersion silver
. Gold fingers (hard gold)
. OSP
Other:
. Account of layers: Double-side to above 20 layers (1 to 30 layers)
. Max PCB dimensions: 23 x 35 inches (584.2 x 889.0mm)
. Solder mask bridge between solder dam: 4mil (0.10mm)
. Minimum solder mask annular: 1.5mil (0.038mm)
. Min thickness of solder mask: 0.40mil (10um)
. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable solder mask
. Min height of Legend: 4mil (0.10mm)
. Min width of front: 25mil (0.635mm)
. Legend colors: White, yellow, black
Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++
Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating
Other test: Impendence control, resistor of hole test, micro section, ionic cleanliness test, Soldering capacity, thermal shocking, reliability test, etc.

SELL
Chi Tun Electronics Co is an experienced professional supplier of PCB(including rigid, flex and rigid-flex circuits, and HDI boards, And whether you need quick-turn, prototype, short-run or high volume production)

TECHNOLOGY:
. RoHS/ Lead Free
. HDI Microvias
. Blind Vias
. Buried Vias
. Selective Plating
. Impedance Control
Manufacturing Standard:
. IPC-A-600G Class II
. IPC-A-600G Class III
. PERFAG 2E for Double-Sided Board
. PERFAG 3C for Multilayer Board
Capability
Min. Finished Holes Size: 0.008" (0.20mm)
Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)
Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)
Maximum copper thickness: 5oz (140um)
Thin board thickness:
. DS - 0.008 inches (0.20mm)
. 4/L - 0.016 (0.40mm)
. 6/L - 0.020 inches (0.60mm)
Maximum board thickness:
. 275.8mil (7.0mm)
Surface treatment:
. HASL/lead free HAL/gold plating
. Immersion gold
. Immersion tin
. Immersion silver
. Gold fingers (hard gold)
. OSP
Other:
. Account of layers: Double-side to above 20 layers (1 to 30 layers)
. Max PCB dimensions: 23 x 35 inches (584.2 x 889.0mm)
. Solder mask bridge between solder dam: 4mil (0.10mm)
. Minimum solder mask annular: 1.5mil (0.038mm)
. Min thickness of solder mask: 0.40mil (10um)
. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable solder mask
. Min height of Legend: 4mil (0.10mm)
. Min width of front: 25mil (0.635mm)
. Legend colors: White, yellow, black
Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++
Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating